Invention Grant
- Patent Title: Conductive wire piece supply method and conductive wire piece supply device
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Application No.: US14465425Application Date: 2014-08-21
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Publication No.: US09641056B2Publication Date: 2017-05-02
- Inventor: Shinichi Kawano , Kenichi Ohno , Daisuke Ueno , Kanomi Hayashi , Satoru Saito
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2013-174946 20130826
- Main IPC: B65G57/00
- IPC: B65G57/00 ; H02K15/04
Abstract:
A conductive wire piece supply method includes the steps of: obtaining a conductive wire piece set using a first slot which receives conductive wire pieces, having been sent, with the conductive wire pieces vertically superposed on each other; carrying the conductive wire piece set from the first slot portion to the second slot portion; and rotating the second slot portion.
Public/Granted literature
- US20150056054A1 CONDUCTIVE WIRE PIECE SUPPLY METHOD AND CONDUCTIVE WIRE PIECE SUPPLY DEVICE Public/Granted day:2015-02-26
Information query
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