Invention Grant
- Patent Title: Reconfigurable semiconductor device
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Application No.: US15133863Application Date: 2016-04-20
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Publication No.: US09641180B2Publication Date: 2017-05-02
- Inventor: Masayuki Satou , Isao Shimizu
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2015-090915 20150428
- Main IPC: H03K19/17
- IPC: H03K19/17 ; H03K19/177 ; G11C8/10 ; G11C7/00

Abstract:
There is provided a reconfigurable semiconductor device including a plurality of circuit blocks each including a reconfigurable logic unit, and an analog circuit configured to convert an analog signal from the outside into a digital signal to output the digital signal to the reconfigurable logic unit, and convert a digital signal outputted from the reconfigurable logic unit into an analog signal to output the analog signal to the outside. The circuit block has a rectangular shape, is connected to the two adjacent circuit blocks from one side with a plurality of analog lines, and is connected to the other two adjacent circuit blocks from the other side on a side opposite to the one side with a plurality of analog lines.
Public/Granted literature
- US20160322974A1 RECONFIGURABLE SEMICONDUCTOR DEVICE Public/Granted day:2016-11-03
Information query
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