A wireless communication circuit includes a vibration piece, and a semiconductor device that is connected to the vibration piece in order to integrate the vibration piece and a wireless communication IC into one package and thus to produce a wireless communication device by which a high-precision oscillation frequency is obtained. The semiconductor device includes an oscillation circuit of the vibration piece, and a wireless communication circuit that has an amplifier which amplifies a wireless signal that is generated by an oscillation signal from the oscillation circuit. The vibration piece and the semiconductor device are accommodated in one package. An excitation electrode of the vibration piece is arranged in the package in such a manner that the excitation electrode is not superimposed on the amplifier when the semiconductor device is viewed from above.