Invention Grant
- Patent Title: Image sensor with flexible interconnect capabilities
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Application No.: US14633261Application Date: 2015-02-27
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Publication No.: US09641776B2Publication Date: 2017-05-02
- Inventor: Graham Kirsch
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Treyz Law Group, P.C.
- Agent Jason Tsai; Joseph Guihan
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335 ; H04N5/228 ; H04N5/372 ; H04N5/341 ; H04N5/345 ; H04N5/376 ; H04N5/378

Abstract:
Electronic devices may include image sensors having configurable image sensor pixel interconnections. Image sensors may include image sensor pixels coupled to analog circuitry via configurable interconnect circuitry. The analog circuitry may include many analog circuit blocks. The analog circuit blocks may control and read out signals from associated image sensor pixels. The configurable interconnect circuitry may be controlled to reroute the connections between the analog circuit blocks and specific groups of image sensor pixels. Digital circuitry may be coupled to the analog circuitry via configurable interconnect circuitry. The digital circuitry may include digital circuit blocks. There may be significantly more image pixels controlled by a small number of analog circuit blocks, which are in turn controlled by a smaller number of digital circuit blocks. The image sensor pixel array, the configurable interconnect circuitry, the analog circuitry, and the digital circuitry may be vertically stacked.
Public/Granted literature
- US20150172578A1 IMAGE SENSOR WITH FLEXIBLE INTERCONNECT CAPABILITIES Public/Granted day:2015-06-18
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