A method for mounting a flexible electronics component to a support structure includes bending the flexible electronics component to be aligned with a curved contour. The curved contour is determined based on a flexibility requirement of a product in which the flexible electronics component is to be integrated and one or more flexibility constraints of the flexible electronics component. The method also includes bending the support structure to be aligned with the curved contour, and adhering the bent flexible electronics component to the bent support structure to produce a flexible electronics assembly.