Invention Grant
- Patent Title: Method of manufacturing a printed circuit board assembly sheet
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Application No.: US14141705Application Date: 2013-12-27
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Publication No.: US09642262B2Publication Date: 2017-05-02
- Inventor: Jun Ishii , Terukazu Ihara , Naohiro Terada
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2010-177632 20100806
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K3/46 ; H05K1/02 ; H05K3/00 ; G11B5/48
Abstract:
A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
Public/Granted literature
- US20140101934A1 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET Public/Granted day:2014-04-17
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