Invention Grant
- Patent Title: Component mounting device
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Application No.: US15034769Application Date: 2013-11-11
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Publication No.: US09642295B2Publication Date: 2017-05-02
- Inventor: Chikashi Teshima
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/080437 WO 20131111
- International Announcement: WO2015/068305 WO 20150514
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08

Abstract:
In a component mounting device, a head held by a head holding section is automatically exchanged from one of a pickup head attached with a suction nozzle that holds and releases component, and a dispensing head with a dispensing tool that dispenses adhesive, to the other of the heads. When the pickup head is held, a nozzle camera images the suction nozzles at nozzle positions attached to the pickup head from the side using an optical system unit and acquires suction nozzle image data. When the dispensing head is held, the nozzle camera images a dispensing nozzle positioned at the center axis of the head holding body from the side using the optical system unit and acquires dispensing nozzle image data. Component related inspection is performed based on the suction nozzle image data and dispensing related inspection is performed based on the dispensing nozzle image data.
Public/Granted literature
- US20160302336A1 COMPONENT MOUNTING DEVICE Public/Granted day:2016-10-13
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