Invention Grant
- Patent Title: Electrical feedthrough assembly
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Application No.: US14873987Application Date: 2015-10-02
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Publication No.: US09643021B2Publication Date: 2017-05-09
- Inventor: Kurt J. Koester , Chuladatta Thenuwara , Timothy Beerling , Mark B. Downing , David Stuursma , Logan P. Palmer
- Applicant: Advanced Bionics AG
- Applicant Address: CH Staefa
- Assignee: Advanced Bionics AG
- Current Assignee: Advanced Bionics AG
- Current Assignee Address: CH Staefa
- Agent Fabian VanCott; Steven Nichols
- Main IPC: H01L25/16
- IPC: H01L25/16 ; A61N1/375 ; A61N1/36 ; A61N1/05 ; H01L23/498 ; H01L23/055
Abstract:
A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.
Public/Granted literature
- US20160106988A1 Electrical Feedthrough Assembly Public/Granted day:2016-04-21
Information query
IPC分类:
