Invention Grant
- Patent Title: Bi-directional airflow heatsink
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Application No.: US14493279Application Date: 2014-09-22
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Publication No.: US09643233B2Publication Date: 2017-05-09
- Inventor: Edmond I. Bailey , Christopher M. Helberg , Travis C. North , Austin Michael Shelnutt
- Applicant: DELL PRODUCTS, L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products, L.P.
- Current Assignee: Dell Products, L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Isidore PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B21D53/02 ; H01L23/473

Abstract:
An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink.
Public/Granted literature
- US20160088775A1 BI-DIRECTIONAL AIRFLOW HEATSINK Public/Granted day:2016-03-24
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