Invention Grant
- Patent Title: Wire discharge-machining apparatus with parallel cutting wires
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Application No.: US14702409Application Date: 2015-05-01
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Publication No.: US09643270B2Publication Date: 2017-05-09
- Inventor: Hidetaka Miyake , Tatsushi Sato
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-157236 20080616
- Main IPC: B23H7/02
- IPC: B23H7/02 ; H01L21/78 ; B23H7/10 ; B23H1/02 ; B23H7/08 ; B28D5/04 ; B23H9/00 ; B23H11/00

Abstract:
A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. In the parallel cutting wires, the feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires.
Public/Granted literature
- US20150231719A1 WIRE DISCHARGE-MACHINING APPARATUS WITH PARALLEL CUTTING WIRES Public/Granted day:2015-08-20
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