Invention Grant
- Patent Title: Polishing method
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Application No.: US15066896Application Date: 2016-03-10
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Publication No.: US09643291B2Publication Date: 2017-05-09
- Inventor: Genichiro Hagiwara
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2013-233486 20131111
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B13/02

Abstract:
A polishing method comprising: arranging a polishing tool and a workpiece on lower and upper shaft sides of a polishing device, respectively, the polishing tool including: a polishing surface having a spherical zone shape; and a hole that is provided inside the polishing surface and concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to the rotation axis, a ratio of an outer diameter of the polishing surface to an inner diameter of the polishing surface being greater than 1.0 and 6.0 or less; and swinging the polishing tool relative to a reference point while rotating the polishing tool around the rotation axis. The reference point is positioned where a straight line, which passes through a center of the workpiece and intersects with the rotation axis, passes through a center of a spherical zone of the polishing surface in width direction.
Public/Granted literature
- US20160193710A1 POLISHING METHOD Public/Granted day:2016-07-07
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