Invention Grant
- Patent Title: Resin molding apparatus and resin molding method
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Application No.: US14123759Application Date: 2012-06-07
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Publication No.: US09643345B2Publication Date: 2017-05-09
- Inventor: Takahiro Nakahashi , Hiroyuki Hanato
- Applicant: Takahiro Nakahashi , Hiroyuki Hanato
- Applicant Address: JP Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2011-128558 20110608
- International Application: PCT/JP2012/064713 WO 20120607
- International Announcement: WO2012/169599 WO 20121213
- Main IPC: B29C37/00
- IPC: B29C37/00 ; B29D11/00 ; B29C33/44 ; B29C45/56 ; B29C43/02 ; B29C43/50 ; B29L11/00

Abstract:
A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a) for transferring a predetermined lens shape to a resin material; a mold (2) having a transfer surface (2a) for transferring a predetermined lens shape to the resin material; a support device (3) for moving the mold (1); a heating device (4) curing the resin material so as to form a lens, the resin material having been supplied between the transfer surface (1a) and the transfer surface (2a); and an ultrasonic vibrator (5) applying vibration from a side surface of the mold (1 or 2) so as to form a gap at least at a part between the transfer surface (1a or 2a) and the lens.
Public/Granted literature
- US20140103552A1 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD Public/Granted day:2014-04-17
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