- Patent Title: Wet-out prevent method using laminate for injection molding process
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Application No.: US14023974Application Date: 2013-09-11
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Publication No.: US09643350B2Publication Date: 2017-05-09
- Inventor: Jason Robert Emrich , Inshirah Hillawi , Megan May Lovejoy , Steven J. Antilla
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Price Heneveld LLP
- Agent Vichit Chea
- Main IPC: G02B6/00
- IPC: G02B6/00 ; B29C45/16 ; B29D11/00 ; B29K101/00 ; B29L11/00

Abstract:
A light guide system includes a light guide and a carrier substrate having a barrier layer disposed therebetween. The barrier layer is introduced during a dual injection process to provide a permeable barrier between a first resin, used to form the light guide, and a second resin used to form the carrier substrate. The barrier layer allows for the first and second resins to bond, while acting as a wet-out inhibitor between the resins. The molded dual injection light guide system of the present invention provides for a unitary light guide and carrier substrate that has been molded with a barrier layer such that wetting out of a surface of the light guide is prevented along with the deleterious effects wetted out surfaces have on light transmission.
Public/Granted literature
- US20150069644A1 WET-OUT PREVENT METHOD USING LAMINATE FOR INJECTION MOLDING PROCESS Public/Granted day:2015-03-12
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