Invention Grant
- Patent Title: Wire harness
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Application No.: US15000082Application Date: 2016-01-19
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Publication No.: US09643545B2Publication Date: 2017-05-09
- Inventor: Tatsuya Oga , Hideomi Adachi
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2013-150013 20130719
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02 ; H01B7/00

Abstract:
A wire harness includes a conducting path. The conducting path includes a conductor and a sheath. The conductor includes a first conductor and a second conductor which are connected to each other. The first conductor is disposed in a route regulation section requiring route regulation. The second conductor is disposed in another section than the route regulation section. The conductor in which the first conductor and the second conductor are connected to each other is covered with the sheath.
Public/Granted literature
- US20160129861A1 Wire Harness Public/Granted day:2016-05-12
Information query
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