Invention Grant
- Patent Title: Curable resin composition and cured product thereof, encapsulant, and semiconductor device
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Application No.: US14837025Application Date: 2015-08-27
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Publication No.: US09644098B2Publication Date: 2017-05-09
- Inventor: Shigeaki Kamuro , Yasunobu Nakagawa
- Applicant: DAICEL CORPORATION
- Applicant Address: JP Osaka-Shi
- Assignee: DAICEL CORPORATION
- Current Assignee: DAICEL CORPORATION
- Current Assignee Address: JP Osaka-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-026947 20130214
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L83/06 ; C08L83/04 ; C08K5/5435 ; C09D183/04 ; C08K5/54 ; C08G77/12 ; C08G77/20 ; C08G77/00 ; H01L33/56 ; C08K5/3492

Abstract:
Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas.The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
Public/Granted literature
- US20150368514A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, ENCAPSULANT, AND SEMICONDUCTOR DEVICE Public/Granted day:2015-12-24
Information query
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