Disclosed herein are compounds having the formula: R1—(CO—NH—R2—R3)n and polymers made by moisture curing the compound. R1 is an organic group, a dimeric fatty acid chain, a dimeric linoleic fatty acid chain, a trimeric fatty acid chain, a saturated form of any thereof, a residue of a phenalkamine compound, or a residue of a polyamine. Each R2 is an aliphatic group or an aminoaliphatic group. Each R3 comprises an alkoxysilane group. The value n is a positive integer. The compound may be made by reacting a polyester with an amine having an alkoxysilane group or reacting a polyacid with an isocyanate having an alkoxysilane group. Also disclose are compounds made by reacting an amido amine with an epoxy compound.