Invention Grant
- Patent Title: Method of releasably attaching a semiconductor substrate to a carrier
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Application No.: US14636981Application Date: 2015-03-03
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Publication No.: US09644118B2Publication Date: 2017-05-09
- Inventor: Mark S. Oliver , Zhifeng Bai , Michael K. Gallagher
- Applicant: Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC
- Applicant Address: US MI Midland US MA Marlborough
- Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MI Midland US MA Marlborough
- Agent S. Matthew Cairns
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; C09J11/06 ; H01L23/00 ; H01L21/683 ; C09J4/00
Abstract:
Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.
Public/Granted literature
- US20160257861A1 EPHEMERAL BONDING Public/Granted day:2016-09-08
Information query
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