Invention Grant
- Patent Title: Material self-assembly method and selective adhesion method based on molecular recognition
-
Application No.: US14708926Application Date: 2015-05-11
-
Publication No.: US09644119B2Publication Date: 2017-05-09
- Inventor: Akira Harada , Ryosuke Kobayashi , Hiroyasu Yamaguchi , Akihito Hashidzume , Yoshinori Takashima
- Applicant: Osaka University
- Applicant Address: JP Suita-shi
- Assignee: Osaka University
- Current Assignee: Osaka University
- Current Assignee Address: JP Suita-shi
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2010-205565 20100914
- Main IPC: C08F220/56
- IPC: C08F220/56 ; C09J133/26 ; C09J105/16 ; C08L33/26 ; C08L101/02 ; C08G83/00 ; C08J3/075 ; C08F220/54
Abstract:
The present invention provides a selective adhesion method and a self-assembly method for macroscale materials based on molecular recognition. One or more host bodies formed from a macromolecule having one or more host groups on the side chains, and one or more guest bodies formed from a macromolecule having one or more guest groups on the side chains are vibrated in a solvent to selectively form an assembly.
Public/Granted literature
- US20150259579A1 MATERIAL SELF-ASSEMBLY METHOD AND SELECTIVE ADHESION METHOD BASED ON MOLECULAR RECOGNITION Public/Granted day:2015-09-17
Information query
IPC分类:
