Invention Grant
- Patent Title: Copper alloy sheet for electric and electronic part
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Application No.: US13585076Application Date: 2012-08-14
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Publication No.: US09644250B2Publication Date: 2017-05-09
- Inventor: Yasuhiro Aruga , Ryoichi Ozaki , Yosuke Miwa
- Applicant: Yasuhiro Aruga , Ryoichi Ozaki , Yosuke Miwa
- Applicant Address: JP Kobe-shi
- Assignee: KOBE STEEL, LTD.
- Current Assignee: KOBE STEEL, LTD.
- Current Assignee Address: JP Kobe-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-199777 20060721; JP2006-199778 20060721; JP2006-199779 20060721; JP2007-129468 20070515
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22C9/02 ; C22C9/04 ; C22F1/00 ; C22F1/08 ; H05K1/09

Abstract:
A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.
Public/Granted literature
- US20120308429A1 COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART Public/Granted day:2012-12-06
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