- Patent Title: Cu—Zr-based copper alloy plate and process for manufacturing same
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Application No.: US14000043Application Date: 2012-02-10
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Publication No.: US09644251B2Publication Date: 2017-05-09
- Inventor: Takeshi Sakurai , Yoshio Abe , Naotake Hirano
- Applicant: Takeshi Sakurai , Yoshio Abe , Naotake Hirano
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Shindoh Co., Ltd.
- Current Assignee: Mitsubishi Shindoh Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2011-033097 20110218
- International Application: PCT/JP2012/053158 WO 20120210
- International Announcement: WO2012/111567 WO 20120823
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22C9/06 ; C22F1/08

Abstract:
Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
Public/Granted literature
- US20130319584A1 Cu-Zr-BASED COPPER ALLOY PLATE AND PROCESS FOR MANUFACTURING SAME Public/Granted day:2013-12-05
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