Invention Grant
- Patent Title: Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer readable recording medium
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Application No.: US14503707Application Date: 2014-10-01
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Publication No.: US09644265B2Publication Date: 2017-05-09
- Inventor: Takafumi Sasaki , Tetsuo Yamamoto
- Applicant: Hitachi Kokusai Electric Inc.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Edell, Shapiro & Finnan LLC
- Priority: JP2013-270652 20131227
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/52 ; C23C16/455 ; H01L21/02 ; C23C16/34 ; H01J37/32

Abstract:
Provided are a method of manufacturing semiconductor device, a substrate processing apparatus and a recording medium which are capable of efficiently removing a deposited film in a shower head and suppressing generation of particles. The method of manufacturing a semiconductor device includes (a) forming a film on a substrate by supplying a film forming gas and an inert gas to the substrate in a processing chamber via a shower head, and (b) removing a deposited film deposited in the shower head in (a) by supplying to the shower head an inert gas, which has a temperature lower than that of the inert gas supplied in (a), into the shower head without the substrate loaded in the processing chamber.
Public/Granted literature
Information query
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