Invention Grant
- Patent Title: Zinc-nickel alloy plating solution and plating method
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Application No.: US14779344Application Date: 2014-03-24
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Publication No.: US09644279B2Publication Date: 2017-05-09
- Inventor: Mitsuhiro Omachi , Atsushi Kaneko , Satoshi Ito
- Applicant: Nippon Hyomen Kagaku Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Nippon Hyomen Kagaku Kabushiki Kaisha
- Current Assignee: Nippon Hyomen Kagaku Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JP2013-067377 20130327
- International Application: PCT/JP2014/058115 WO 20140324
- International Announcement: WO2014/157105 WO 20141002
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D5/36 ; C25D5/48

Abstract:
To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm2 or more. An acidic zinc-nickel alloy electroplating solution which contains an amine compound represented by the formula H2N—R1-R2 {wherein: R1 is [(CH2)M—NH]L or (CH2)N; R2 is H, NH2, or R3; R3 is an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5}.
Public/Granted literature
- US20160068984A1 ZINC-NICKEL ALLOY PLATING SOLUTION AND PLATING METHOD Public/Granted day:2016-03-10
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