Invention Grant
- Patent Title: Packing and seal structure of battery module
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Application No.: US14551486Application Date: 2014-11-24
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Publication No.: US09644739B2Publication Date: 2017-05-09
- Inventor: Yoshitaka Uchida , Tetsuya Sugizaki , Tomohiro Higaki
- Applicant: OHTSUKA POLY-TECH CO., LTD. , HONDA MOTOR CO., LTD.
- Applicant Address: JP Hiki-Gun, Saitama JP Tokyo
- Assignee: OHTSUKA POLY-TECH CO., LTD.,HONDA MOTOR CO., LTD.
- Current Assignee: OHTSUKA POLY-TECH CO., LTD.,HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Hiki-Gun, Saitama JP Tokyo
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2013-242990 20131125
- Main IPC: F16J15/06
- IPC: F16J15/06 ; F16J15/02 ; H01M2/10 ; H01M10/6563 ; H01M10/6556
Abstract:
A packing includes a base part that is attached to a duct, and a seal lip part that extends from the base part toward a battery module to press against the battery module. A first bend portion is provided midway in the seal lip part. A second bend portion is provided in a continuous portion between the base part and the seal lip part. The first bend portion and the second bend portion are bent in a direction opposite to each other.
Public/Granted literature
- US20150147639A1 PACKING AND SEAL STRUCTURE OF BATTERY MODULE Public/Granted day:2015-05-28
Information query
IPC分类:
