Invention Grant
- Patent Title: Systems and methods for providing a field repairable light fixture with a housing that dissipates heat
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Application No.: US13870642Application Date: 2013-04-25
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Publication No.: US09644829B2Publication Date: 2017-05-09
- Inventor: Ken McAlpin
- Applicant: XtraLight Manufacturing, Ltd
- Applicant Address: US TX Houston
- Assignee: XtraLight Manufacturing, Ltd.
- Current Assignee: XtraLight Manufacturing, Ltd.
- Current Assignee Address: US TX Houston
- Agency: Norton Rose Fulbright US LLP
- Main IPC: F21V23/00
- IPC: F21V23/00 ; F21V29/00 ; H05K1/02 ; F21V29/507 ; F21V29/70 ; F21V5/04 ; F21W131/10 ; F21Y103/00 ; F21Y101/00 ; F21Y105/00 ; F21Y105/10 ; F21Y115/10 ; F21Y115/15

Abstract:
Systems and methods disclosed herein provide one or more light emitting diode (LED) lighting fixture, which effectively dissipate heat. Embodiments include one or more printed circuit board (PCB) each having a front surface and a back surface, wherein the front surface may comprise strategically spaced LEDs and one or more thermal heat dissipaters, which draw heat away from the LEDs. The back surface may comprise one or more thermal heat dissipaters, covering a substantial portion of the back surface, wherein the back surface thermal heat dissipaters are thermally connected to the front surface thermal heat dissipaters. The LED fixture may also comprise one or more drivers which drive the PCB. The PCB and driver may be housed within a PCB chamber and a driver chamber, respectively, of a housing fixture, which may provide heat dissipation, structural support, and environmental protection for the components housed therein.
Public/Granted literature
- US20130235584A1 SYSTEMS AND METHODS FOR PROVIDING A FIELD REPAIRABLE LIGHT FIXTURE WITH A HOUSING THAT DISSIPATES HEAT Public/Granted day:2013-09-12
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