Invention Grant
- Patent Title: Method and apparatus for laser projection, and machining method
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Application No.: US14079515Application Date: 2013-11-13
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Publication No.: US09644942B2Publication Date: 2017-05-09
- Inventor: Hiroyuki Nakano , Nobuhisa Seya , Daisuke Igarashi , Kazuhiro Igarashi , Youhei Maekawa , Katsuto Numayama
- Applicant: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Applicant Address: JP Kanagawa
- Assignee: Mitsubishi Hitachi Power Systems, Ltd.
- Current Assignee: Mitsubishi Hitachi Power Systems, Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2012-260466 20121129; JP2013-040670 20130301
- Main IPC: G05B19/18
- IPC: G05B19/18 ; G01B11/00 ; G01B11/25 ; B23Q17/22 ; B23Q17/24 ; G05B19/401 ; G05B19/4097

Abstract:
A laser projection method including the steps of: irradiating, from a laser projection unit, a workpiece that is a measurement object, with a laser while controlling a plurality of mirror angles; imaging the workpiece with a stereo camera, extracting a contour of the workpiece, and calculating a three-dimensional coordinate; calculating a positional relationship between the laser projection unit and the workpiece by comparing the calculated three-dimensional coordinate of the workpiece contour with the minor angle; and performing coordinate transformation of CAD data information and drawing CAD data from the laser projection unit to the workpiece, based on the positional relationship between the laser projection unit and the workpiece. The machining method including the steps of: selecting a component of a tool; assembling the component; imaging the tool assembled; and determining whether or not a desired tool has been assembled.
Public/Granted literature
- US20140148939A1 METHOD AND APPARATUS FOR LASER PROJECTION, AND MACHINING METHOD Public/Granted day:2014-05-29
Information query
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