Invention Grant
- Patent Title: Method and device for measuring polishing amount of optical fiber component
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Application No.: US14442845Application Date: 2012-12-13
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Publication No.: US09644944B2Publication Date: 2017-05-09
- Inventor: Toshihide Saitoh , Yasunori Senno
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- International Application: PCT/JP2012/082408 WO 20121213
- International Announcement: WO2014/091610 WO 20140619
- Main IPC: G01B11/02
- IPC: G01B11/02 ; B24B19/22 ; B24B49/12 ; G01M11/08 ; G01B9/02 ; G01M11/00 ; G02B6/38

Abstract:
The polishing amount of an optical fiber component can be measured directly, accurately and easily in a real-time mode during polishing, regardless of the polishing amount of a ferrule. Provided is a method for measuring the polishing amount of an optical fiber component while performing polishing, the method including: branching an inspection light among a reference optical path having a variable optical path length, an optical fiber component being measured, and a comparison optical path, and determining a polishing amount of the optical fiber component by a change amount of a difference Lc between a reference optical path length when return light of the reference optical path interferes with return light of the optical fiber component being measured and a reference optical path length when the return light of the reference optical path interferes with return light of the comparison optical path.
Public/Granted literature
- US20150285617A1 METHOD AND DEVICE FOR MEASURING POLISHING AMOUNT OF OPTICAL FIBER COMPONENT Public/Granted day:2015-10-08
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