Invention Grant
- Patent Title: Proximity sensor, electronic apparatus and method for manufacturing proximity sensor
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Application No.: US14981196Application Date: 2015-12-28
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Publication No.: US09645238B1Publication Date: 2017-05-09
- Inventor: Jing-En Luan
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group LLP
- Priority: CN201510734019 20151102
- Main IPC: G01J1/42
- IPC: G01J1/42 ; G01S17/02 ; G01J1/04

Abstract:
The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.
Public/Granted literature
- US20170123064A1 PROXIMITY SENSOR, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PROXIMITY SENSOR Public/Granted day:2017-05-04
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