Invention Grant
- Patent Title: Optical module
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Application No.: US15106934Application Date: 2014-12-22
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Publication No.: US09645330B2Publication Date: 2017-05-09
- Inventor: Ayano Kon , Shimpei Morioka
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2013-265288 20131224
- International Application: PCT/JP2014/083846 WO 20141222
- International Announcement: WO2015/098802 WO 20150702
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/38 ; G02B6/32 ; G02B6/42

Abstract:
This optical module comprises a substrate, light-emitting elements, a ferrule, an optical receptacle, through-holes and an adhesive. The optical receptacle includes two support units, and an optical receptacle body that has a first optical surface and a second optical surface. The through-holes include two first through-holes surrounded by the leading ends of the support units and the ferrule, and two second through-holes which are surrounded by the optical receptacle body, the support units and the ferrule. Thus, even using the adhesive to fix the optical receptacle and the ferrule to the substrate, it is possible to optically connect multiple optical transmission bodies with multiple light-emitting elements or multiple light-receiving elements in a suitable manner.
Public/Granted literature
- US20170038539A1 OPTICAL MODULE Public/Granted day:2017-02-09
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