A memory device comprising a temperature sensor mounted on a surface of a substrate, the temperature sensor in electrical communication with a heating element and configured to activate the heating element in response to detecting a temperature below a predetermined temperature threshold. The heating element is in thermal communication with a solid state memory configured to store computer readable data. A universal serial bus (USB) driver is also mounted to the substrate, in electrical communication with the memory, and configured to communicate with another USB device via a USB channel in order to transfer data to and from the memory. The memory device can be enclosed in a protective backshell canister connected to the MIL-DTL-38999 type connector to provide a fully ruggedized, fully sealed device to withstand and operate effectively in extreme environmental conditions.