Invention Grant
- Patent Title: Systems and methods for haptic feedback for modular devices
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Application No.: US14710823Application Date: 2015-05-13
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Publication No.: US09645647B2Publication Date: 2017-05-09
- Inventor: Vincent Levesque
- Applicant: Immersion Corporation
- Applicant Address: US CA San Jose
- Assignee: Immersion Corporation
- Current Assignee: Immersion Corporation
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04B3/36
- IPC: H04B3/36 ; G06F3/01 ; G06F3/041 ; G06F1/16

Abstract:
One illustrative haptic output device disclosed herein includes a connector configured to couple the haptic output device to a modular computing device. The modular computing device includes an outer housing configured to mechanically and electrically couple with one or more external electronic modules. The haptic output device also includes a receiver configured to receive a haptic signal from a processor. The processor is configured to receive a signal; determine a haptic effect based in part on the signal; generate the haptic signal based on the haptic effect; and transmit the haptic signal. The haptic output device is configured to output the haptic effect responsive to receiving the haptic signal.
Public/Granted literature
- US20160334871A1 Systems and Methods for Haptic Feedback for Modular Devices Public/Granted day:2016-11-17
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