Invention Grant
- Patent Title: 3D resist profile aware etch-bias model
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Application No.: US14712663Application Date: 2015-05-14
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Publication No.: US09646127B2Publication Date: 2017-05-09
- Inventor: Hua Song , Cheng En Wu , James P. Shiely
- Applicant: Synopsys, Inc.
- Applicant Address: US CA Mountain View
- Assignee: SYNOPSYS, INC.
- Current Assignee: SYNOPSYS, INC.
- Current Assignee Address: US CA Mountain View
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Laxman Sahasrabuddhe
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/36 ; G03F1/80 ; G03F7/20

Abstract:
Systems and techniques for using a three-dimension (3D) resist profile aware etch-bias model are described. A 3D resist profile aware etch-bias model can be calibrated based on empirical data. Next, the 3D resist profile aware etch-bias model can be used in one or more applications, including, but not limited to, lithography verification, etch correction, optical proximity correction, and assist feature placement.
Public/Granted literature
- US20160335384A1 3D RESIST PROFILE AWARE ETCH-BIAS MODEL Public/Granted day:2016-11-17
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