Invention Grant
- Patent Title: Method for producing silver-plated product
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Application No.: US14348118Application Date: 2012-09-20
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Publication No.: US09646739B2Publication Date: 2017-05-09
- Inventor: Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
- Applicant: DOWA METALTECH CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA METALTECH CO., LTD.
- Current Assignee: DOWA METALTECH CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Bachman & LaPointe, PC
- Priority: JP2011-216530 20110930
- International Application: PCT/JP2012/074813 WO 20120920
- International Announcement: WO2013/047628 WO 20130404
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01B5/14 ; H01B1/02 ; C22C5/06 ; C23C30/00 ; C25D3/46 ; C25D7/00 ; C23C28/02 ; H01R13/03 ; H01H1/023 ; H01H11/04 ; H01R43/16 ; C25D5/34

Abstract:
There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.
Public/Granted literature
- US20150243408A1 SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME Public/Granted day:2015-08-27
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