A process for a substrate having a component-disposing area is provided, and includes the following steps. A core layer including a first surface, a metallic layer and a component-disposing area is provided. The metallic layer is disposed on the first surface and patterned to form a patterned metallic layer including pads located in the component-disposing area. A first dielectric layer is formed on the first surface and covers the patterned metallic layer. A laser-resistant metallic pattern is formed on the first dielectric layer and surrounds a projection area of the first dielectric layer. A release film is disposed on the projection area and covers a portion of the laser-resistant metallic pattern within the projection area. A second dielectric layer is formed on the first dielectric layer and covers the release film and the laser-resistant metallic pattern. A first open hole and a plurality of second open holes are formed.