- Patent Title: Semiconductor device with metal carrier and manufacturing method
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Application No.: US14711198Application Date: 2015-05-13
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Publication No.: US09646855B2Publication Date: 2017-05-09
- Inventor: Oliver Haeberlen , Walter Rieger , Christoph Kadow , Markus Zundel
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L31/0304 ; H01L21/48 ; H01L29/06 ; H01L29/417 ; H01L29/66 ; H01L29/778 ; H01L21/768 ; H01L29/20

Abstract:
Semiconductor device including a metal carrier substrate. Above the carrier substrate a first semiconductor layer of Alx1Gay1Inz1N (x1+y1+z1=1, x1≧0, y1≧0, z1≧0) is formed. A second semiconductor layer of Alx2Gay2Inz2N (x2+y2+z2=1, x2>x1, y2≧0, z2≧0) is arranged on the first semiconductor layer and a gate region is arranged on the second semiconductor layer. The semiconductor device furthermore includes a source region and a drain region, wherein one of these regions is electrically coupled to the metal carrier substrate and includes a conductive region extending through the first semiconductor layer.
Public/Granted literature
- US20150249020A1 SEMICONDUCTOR DEVICE WITH METAL CARRIER AND MANUFACTURING METHOD Public/Granted day:2015-09-03
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