A method for temporarily bonding a wafer to a support via a temporary bonding arrangement is provided. The arrangement is a composite temporary adhesive layer consisting of a non-silicone thermoplastic resin layer (A) which is releasably bonded to the wafer, a thermosetting siloxane polymer layer (B) laid thereon, and a thermosetting siloxane-modified polymer layer (C) releasably bonded to the support. The method comprises the steps of providing a wafer laminate having a thermosetting silicone composition layer (B′) formed on the resin layer (A) which has been formed on the wafer, providing a support laminate having a siloxane-containing composition layer (C′) formed on the support, joining and heating layer (B′) and layer (C′) in vacuum for bonding and curing the layers together.