The present application discloses a method of fabricating an array substrate comprising forming a via extending through a first insulating layer and a second insulating layer, the via comprising a first sub-via in the first insulating layer and the second sub-via in a second insulating layer; mobilizing a portion of first insulating layer material surrounding the first sub-via; and distributing the mobilized portion of the first insulating layer material over a sidewall of the second sub-via.