Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic apparatus
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Application No.: US14563036Application Date: 2014-12-08
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Publication No.: US09647025B2Publication Date: 2017-05-09
- Inventor: Kazufumi Watanabe , Yasushi Maruyama
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2009-028822 20090210; JP2009-148088 20090622
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/359 ; H01L31/0216 ; H01L31/18 ; H01L21/78
Abstract:
A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.
Public/Granted literature
- US20150085168A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2015-03-26
Information query
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