Invention Grant
- Patent Title: Devices, systems, and methods for ion trapping
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Application No.: US15014709Application Date: 2016-02-03
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Publication No.: US09647055B2Publication Date: 2017-05-09
- Inventor: Daniel Youngner
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L49/02 ; H01L23/64 ; H01L29/94 ; H01L21/768 ; H01L21/02 ; H01L21/288 ; H01L21/3205 ; H01L23/522 ; H01L23/00
Abstract:
Devices, methods, and systems for ion trapping are described herein. One device includes a through-silicon via (TSV) and a trench capacitor formed around the TSV.
Public/Granted literature
- US20160307992A1 DEVICES, SYSTEMS, AND METHODS FOR ION TRAPPING Public/Granted day:2016-10-20
Information query
IPC分类:
