Invention Grant
- Patent Title: Manufacturing method of low temperature polysilicon thin film transistor
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Application No.: US14425052Application Date: 2015-01-16
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Publication No.: US09647088B2Publication Date: 2017-05-09
- Inventor: Gui Chen , Jingfeng Xue , Xin Zhang
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410784059 20141216
- International Application: PCT/CN2015/070890 WO 20150116
- International Announcement: WO2016/095306 WO 20160623
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L29/66 ; H01L21/265 ; H01L29/08 ; H01L29/417 ; H01L21/027 ; H01L21/324

Abstract:
The invention provides a manufacturing method of a low temperature polysilicon thin film transistor, including: providing a substrate; forming a buffer layer on the substrate; simultaneously forming a polysilicon layer and a photoresist layer on the buffer layer; implanting ions into a source region and a drain region; removing the photoresist layer; forming an insulating layer on the polysilicon layer; forming a gate electrode on the insulating layer; and forming a passivation layer on the insulating layer. The passivation layer covers the gate electrode. The invention can only use one time of mask process and one time of ion implantation process to complete the manufacturing processing of the polysilicon layer, the manufacturing process can be simplified and therefore the cost of process is reduced and the productivity is improved.
Public/Granted literature
- US20160343829A1 MANUFACTURING METHOD OF LOW TEMPERATURE POLYSILICON THIN FILM TRANSISTOR Public/Granted day:2016-11-24
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