Invention Grant
- Patent Title: Surface-treated copper foil
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Application No.: US14995950Application Date: 2016-01-14
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Publication No.: US09647272B1Publication Date: 2017-05-09
- Inventor: Kuei-Sen Cheng , Yao-Sheng Lai , Hsi-Hsing Lo , Huei-Fang Huang
- Applicant: Chang Chun Petrochemical Co., Ltd.
- Applicant Address: TW Taipei
- Assignee: Chang Chun Petrochemical Co., Ltd.
- Current Assignee: Chang Chun Petrochemical Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Polsinelli PC
- Main IPC: H01M4/133
- IPC: H01M4/133 ; H01M10/052 ; H01M4/66 ; C25D3/56 ; C25D7/00 ; H01M10/0525 ; H01M4/04 ; H01M4/1393 ; H01M4/02

Abstract:
The present disclosure relates to a surface-treated copper foil which exhibits excellent affinity for an active material layer that is applied to the copper foil in the manufacture of a negative electrode (anode), for use in secondary lithium-ion batteries. The copper foil is plated with chromium and zinc and subsequently subjected to an organic treatment. The surface-treated copper has a surface tension of 34 to 58 dyne/cm and a surface roughness (Rz) of 0.8 to 2.5 μm, and comprises: (a) copper foil; (b) a zinc-chromium layer plated one or both sides of the copper foil, wherein the zinc content in the zinc-chromium layer is from 10 to 120 μg/dm2 and the chromium content in the zinc-chromium layer is from 10 to 35 μg/dm2; and (c) an organic hydrophobic layer applied to the zinc-chromium layer.
Public/Granted literature
- US2588237A Billfold Public/Granted day:1952-03-04
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