Invention Grant
- Patent Title: Radio communication module
-
Application No.: US14328674Application Date: 2014-07-10
-
Publication No.: US09647317B2Publication Date: 2017-05-09
- Inventor: Gye Won Lee , Yeong Yeol Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0089056 20130726
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/00 ; H01Q1/50 ; H01Q1/24

Abstract:
Disclosed herein is a radio communication module, including: a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole; an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole; a ground GND formed on the printed circuit board; and a discharge unit disposed between the receiving unit and the ground and including an ESD diode and a discharge line guiding electrostatic discharge (ESD) introduced from the outside to the ground.
Public/Granted literature
- US20150029074A1 RADIO COMMUNICATION MODULE Public/Granted day:2015-01-29
Information query