A semiconductor apparatus may include an output driver configured to output an internal signal to an external device. The output driver may include a pad coupled to the external device, a pull-up driver coupled to the pad at an end thereof, a first resistance element coupled to the pull-up driver at an end thereof, and configured to receive a first source voltage at the other end thereof, a pull-down driver coupled to the pad at an end thereof, and a second resistance element coupled to the pull-down driver at an end thereof, and configured to receive a first ground voltage at the other end thereof.