Invention Grant
- Patent Title: System and method for managing headphone wires
-
Application No.: US14735470Application Date: 2015-06-10
-
Publication No.: US09648407B2Publication Date: 2017-05-09
- Inventor: Patrick Sean Harper
- Applicant: Kaddan Entertainment, Inc.
- Applicant Address: US NY New York
- Assignee: Kaddan Entertainment, Inc.
- Current Assignee: Kaddan Entertainment, Inc.
- Current Assignee Address: US NY New York
- Agency: Rothwell, Figg, Ernst & Manbeck, p.c.
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
An apparatus for securing headphone/earbud/transducer wires through a clasping structure created when the earbuds are connected. The coupling of the headphones may create a clasping structure whereby the headphone wire can be coiled and then held in place, preventing the wires from knotting or tangling. When the headphones are connected to one another, there may exist a space between them, serving as a closed loop around the coiled headphone wires. When the headphones are unconnected, however, no such loop exists. The width of the loop may be approximately the same thickness of the coiled headphone wires so that friction holds the wires in place.
Public/Granted literature
- US20150365755A1 System and Method for Managing Headphone Wires Public/Granted day:2015-12-17
Information query