A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.