Invention Grant
- Patent Title: Printed circuit boards and methods of manufacturing thereof
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Application No.: US14729158Application Date: 2015-06-03
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Publication No.: US09648735B2Publication Date: 2017-05-09
- Inventor: Joachim Mahler , Ralf Otremba
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014107909 20140605
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/00 ; H05K1/11 ; H05K3/10 ; H05K3/46
Abstract:
A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.
Public/Granted literature
- US20150359091A1 Printed Circuit Boards and Methods of Manufacturing Thereof Public/Granted day:2015-12-10
Information query
