An electronic device includes; a first substrate; a second substrate Located facing the first substrate; a resin layer formed between the first substrate and the second substrate and having a first thermal expansion coefficient; a conductor via penetrating the first substrate and the resin layer; a barrier film covering a side surface of the conductor via; a first film formed between the resin layer and the barrier film and having viscoelasticity; and a second film formed between the first film and the barrier film and having a second thermal expansion coefficient lower than the first thermal expansion coefficient.