Invention Grant
- Patent Title: Composite electronic component and board having the same
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Application No.: US14663445Application Date: 2015-03-19
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Publication No.: US09648746B2Publication Date: 2017-05-09
- Inventor: Heung Kil Park , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0127166 20140923
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H05K3/34 ; H05K1/02

Abstract:
There is provided a composite electronic component and a board having the same, and the composite electronic component may include: an interposer board, and first and second electronic components mounted on upper and lower surfaces of the interposer board, respectively, and first and second electronic components are electrically connected to each other by an electrical connection part provided on the interposer board.
Public/Granted literature
- US20160088735A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2016-03-24
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