A method for producing a circuit board comprising the following steps:—providing at least one first element of the circuit board to be produced, more particularly a multilayer core element;—applying an adhesion-preventing material to a region of the first element to be subsequently exposed;—applying at least one additional layer to the first element;—connecting the first element and the at least one additional layer; and—removing a portion of the additional layer to expose the region of the first element, wherein in the additional layer corresponding to the portion to be subsequently removed, the material of the additional layer is cut through on at least one edge of the portion to be subsequently removed.