An enhanced heat dissipation module having multi-layer heat isolation, made of copper, aluminum, iron, or a combination thereof, includes a protection box, used to receive an electric circuit board. On protection box is provided with at least a notch corresponding to high heat generating electronic components on the electric circuit board. A heat dissipater is provided with a large heat dissipation area disposed opposite to protection box, and it includes at least a fix seat disposed in protrusion on the heat dissipater. The fix seat extends into the notch of the protection box, to contact fully surface of the high heat generating electronic components. An elastic contact plate, disposed in front of the fix seat, to press against surface of the high heat generating electronic components. A plurality of heat conduction tubes are pressed onto the heat dissipater, with one end connected to the fix seat.