Invention Grant
- Patent Title: Method and apparatus for forming a structure on a substrate
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Application No.: US14879667Application Date: 2015-10-09
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Publication No.: US09649729B2Publication Date: 2017-05-16
- Inventor: Stefan Nettesheim , Dariusz Korzec
- Applicant: Maschinenfabrik Reinhausen GmbH
- Applicant Address: DE Regensburg
- Assignee: Maschinenfabrik Reinhausen GmbH
- Current Assignee: Maschinenfabrik Reinhausen GmbH
- Current Assignee Address: DE Regensburg
- Agency: Simpson & Simpson, PLLC
- Priority: DE102013103693 20130412
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/08 ; B23K25/00 ; B23K31/02 ; C23C4/02 ; C23C4/134 ; B23K26/144 ; B23K26/342 ; B23K10/02

Abstract:
Presented is a method for forming at least one structure on a substrate. Utilizing a low-temperature plasma jet, powder, of which the structure shall be constructed, is applied to a surface of the substrate. Using at least one laser beam, heat is input into the substrate and/or the powder within a laser incidence region on the substrate. The heat input delays solidification of the powder particles, which are partly or fully melted in the plasma jet, on the substrate and thereby enables the formation of good adhesion between the applied powder, and thus the structure constructed out of the powder, and the substrate. The invention further relates to an apparatus for performing the method.
Public/Granted literature
- US20160031043A1 METHOD AND APPARATUS FOR FORMING A STRUCTURE ON A SUBSTRATE Public/Granted day:2016-02-04
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